Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
- ISBN
- 9781119313977
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies is a integrated circuits, electronic packaging book by Steffen Kroehnert.
Discover Advances in Embedded and Fan-Out Wafer Level Packaging Technologies by Steffen Kroehnert, integrated circuits.
About the Author
is the author of Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. Browse their full catalog on Booklogr.
Explore more books by Steffen Kroehnert →Editions & Formats
Reviews
No reviews yet. Have you read this book? Share your thoughts with the Booklogr community.
Sign in Sign in to write a review
Frequently Asked Questions
What genre is Advances in Embedded and Fan-Out Wafer Level Packaging Technologies?+
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies is a Integrated circuits, Electronic packaging book.
Who wrote Advances in Embedded and Fan-Out Wafer Level Packaging Technologies?+
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies was written by Steffen Kroehnert.