Manufacturing Challenges in Electronic Packaging
by Y. C. Lee
ISBN
9781461376590
Manufacturing Challenges in Electronic Packaging is a engineering, machinery book by Y. C. Lee.
About this book
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
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Frequently Asked Questions
What genre is Manufacturing Challenges in Electronic Packaging?+
Manufacturing Challenges in Electronic Packaging is a Engineering, Machinery, Electronic packaging, Manufacturing processes book.
What is Manufacturing Challenges in Electronic Packaging about?+
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will beco...
Who wrote Manufacturing Challenges in Electronic Packaging?+
Manufacturing Challenges in Electronic Packaging was written by Y. C. Lee.