Manufacturing Challenges in Electronic Packaging
by Y. C. Lee
- ISBN
- 9781461376590
Manufacturing Challenges in Electronic Packaging es un engineering, machinery book de Y. C. Lee.
Sobre este libro
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
Sobre el Autor
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Preguntas Frecuentes
¿De qué género es Manufacturing Challenges in Electronic Packaging?+
Manufacturing Challenges in Electronic Packaging es un libro de Engineering, Machinery, Electronic packaging, Manufacturing processes.
¿De qué trata Manufacturing Challenges in Electronic Packaging?+
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will beco...
¿Quién escribió Manufacturing Challenges in Electronic Packaging?+
Manufacturing Challenges in Electronic Packaging fue escrito por Y. C. Lee.