Manufacturing Challenges in Electronic Packaging
by Y. C. Lee
- ISBN
- 9781461376590
Manufacturing Challenges in Electronic Packaging est un engineering, machinery book de Y. C. Lee.
À propos de ce livre
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
À propos de l'auteur
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Quel est le genre de Manufacturing Challenges in Electronic Packaging ?+
Manufacturing Challenges in Electronic Packaging est un livre de Engineering, Machinery, Electronic packaging, Manufacturing processes.
De quoi parle Manufacturing Challenges in Electronic Packaging ?+
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will beco...
Qui a écrit Manufacturing Challenges in Electronic Packaging ?+
Manufacturing Challenges in Electronic Packaging a été écrit par Y. C. Lee.