interconnects Books
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Three-dimensional molded interconnect devices (3D-MID)
Franke, Jörg Dipl.-Ing
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Ephraim Suhir
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Design of interconnection networks for programmable logic
Guy Lemieux
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![Ceramic interconnect technology by [name missing] - Book Cover](/api/v1/covers/13d925bd-477c-4d6e-a4cf-05543db06e98/large.webp)
Ceramic interconnect technology
[name missing]
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