Manufacturing Challenges in Electronic Packaging
by Y. C. Lee
- ISBN
- 9781461376590
Manufacturing Challenges in Electronic Packaging è un engineering, machinery book di Y. C. Lee.
Informazioni su questo libro
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
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Domande Frequenti
Di che genere è Manufacturing Challenges in Electronic Packaging?+
Manufacturing Challenges in Electronic Packaging è un libro di Engineering, Machinery, Electronic packaging, Manufacturing processes.
Di cosa parla Manufacturing Challenges in Electronic Packaging?+
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will beco...
Chi ha scritto Manufacturing Challenges in Electronic Packaging?+
Manufacturing Challenges in Electronic Packaging è stato scritto da Y. C. Lee.