Materials for high-density electronic packaging and interconnection
by National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.
ISBN
030904233X
Materials for high-density electronic packaging and interconnection is a electronic packaging, materials book by National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging..
Discover Materials for high-density electronic packaging and interconnection by National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging., electronic packaging.
About the Author
is the author of Materials for high-density electronic packaging and interconnection. Browse their full catalog on Booklogr.
Explore more books by National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging. →Editions & Formats
Reviews
No reviews yet. Have you read this book? Share your thoughts with the Booklogr community.
Sign in Sign in to write a review
Frequently Asked Questions
What genre is Materials for high-density electronic packaging and interconnection?+
Materials for high-density electronic packaging and interconnection is a Electronic packaging, Materials, Microelectronic packaging book.
Who wrote Materials for high-density electronic packaging and interconnection?+
Materials for high-density electronic packaging and interconnection was written by National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging..