Practical guide to the packaging of electronics

Whether designing a new system or troubleshooting a current one, this ingenious reference/text emphasizes reliability problems and the design of systems with incomplete criteria and components-providing a simple approach for estimating thermal and mechanical characteristics of electronic systems.Practical Guide to the Packaging of Electronics discussespackaging/enclosure design and reliabilitythermal, junction-to-case, and contact interface resistancedirect and indirect flow system designfin design and fan selectionvital elements of shock and vibrationthe finite element methodthermal stresses and strains in the design and analysis of mechanically reliable systemsreliability models and system failurethe selection of engineering software to facilitate system analysisdesign parameters in an avionics electronics packagePractical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.