Materials for high-density electronic packaging and interconnection
by National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.
- ISBN
- 030904233X
Materials for high-density electronic packaging and interconnection es un electronic packaging, materials book de National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging..
Descubre Materials for high-density electronic packaging and interconnection de National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging., electronic packaging.
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Preguntas Frecuentes
¿De qué género es Materials for high-density electronic packaging and interconnection?+
Materials for high-density electronic packaging and interconnection es un libro de Electronic packaging, Materials, Microelectronic packaging.
¿Quién escribió Materials for high-density electronic packaging and interconnection?+
Materials for high-density electronic packaging and interconnection fue escrito por National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging..