Materials for high-density electronic packaging and interconnection
by National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.
- ISBN
- 030904233X
Materials for high-density electronic packaging and interconnection est un electronic packaging, materials book de National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging..
Découvrez Materials for high-density electronic packaging and interconnection de National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging., electronic packaging.
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Materials for high-density electronic packaging and interconnection est un livre de Electronic packaging, Materials, Microelectronic packaging.
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Materials for high-density electronic packaging and interconnection a été écrit par National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging..